Note

The following section is only applicable to the DSC 8000, the DSC SWe (on MA-RMS), the Signaling Platform 2000 (SP2000), and the virtual SP2000 (on MA-RMS).

MTP2 to MTP3 communication connections will be automatically created to use SCTP in Release 19.0.

Existing connections, prior to release 19.0, will remain as TIPC connections. 

The Transparent-Interprocess Communication (TIPC) transport layer is used for interprocess communication (IPC) between MTP Level 2 (MTP2) and MTP3.

The TIPC is preconfigured for the DSC - SP2000 Platforms; therefore, no provisioning is required.